Geeclad EL Series

Micron Gold Electroplating baths for electronics and other technical applications

Geeclad El Series electrolytes are suitable for depositing rich high purity gold deposit which is stress free and solder friendly for applications in electronics and other functional  applications. 

Unique Advantages

  • Gold high purity 99.9%

  • Stress free Deposit upto 10 microns

  • Crack free deposit 

  • Good wire bonding ability 

  • Good solder ability

  • Good bath turnover 

  • User friendly  

  • High Plating Speeds

  • Good wear resistance 

  • Electrical conductivity

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Applications

  • Contacts 

  • Connectors

  • Electronic components 

  • PC Boards 

  • Specialised electrical components 

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Products 
Geeclad EL407

Sulphite gold process which gives rich yellow mirror bright deposit of 99.9% purity gold. Bath has exceptional throwing power, thereby minimising gold consumption for a required thickness.

Geeclad EL-HC

High Speed cobalt based acid gold plating bath designed for plating of contacts, connectors and other electronic components. Deposit has excellent anti-galling properties which provide excellent wear resistance.

Geeclad EL-HN

High speed nickel alloy acid gold plating bath designed for plating contacts, connectors and other specalised components. Deposit is hard, bright, ductile and porous free.

Geeclad EL-140

Neutral high speed pure gold plating bath designed for plating of contacts, connectors etc. Deposit has excellent soldering properties. 

Geeclad EL-102

Neutral high speed pure gold plating bath designed for plating transistor, PC boards. Deposit has excellent bonding and soldering properties. 

Geeclad EL-T

eutral gold plating bath for pure gold deposits which is arsenic free and also wire bonding and solder friendly. It is free of Arsenic