Geeclad EL Series
Micron Gold Electroplating baths for electronics and other technical applications
Geeclad El Series electrolytes are suitable for depositing rich high purity gold deposit which is stress free and solder friendly for applications in electronics and other functional applications.
Gold high purity 99.9%
Stress free Deposit upto 10 microns
Crack free deposit
Good wire bonding ability
Good solder ability
Good bath turnover
High Plating Speeds
Good wear resistance
Specialised electrical components
Sulphite gold process which gives rich yellow mirror bright deposit of 99.9% purity gold. Bath has exceptional throwing power, thereby minimising gold consumption for a required thickness.
High Speed cobalt based acid gold plating bath designed for plating of contacts, connectors and other electronic components. Deposit has excellent anti-galling properties which provide excellent wear resistance.
High speed nickel alloy acid gold plating bath designed for plating contacts, connectors and other specalised components. Deposit is hard, bright, ductile and porous free.
Neutral high speed pure gold plating bath designed for plating of contacts, connectors etc. Deposit has excellent soldering properties.
Neutral high speed pure gold plating bath designed for plating transistor, PC boards. Deposit has excellent bonding and soldering properties.
eutral gold plating bath for pure gold deposits which is arsenic free and also wire bonding and solder friendly. It is free of Arsenic